TopoLogic Inc.

TopoLogic Inc. is a Tokyo-based startup founded in 2021, focusing on the development of innovative electronic devices using "topological material" derived from quantum physics. The company specializes in the creation of ultra-fast heat sensors, thermoelectric devices, and high-speed magnetic random-access memory (MRAM) for various applications such as automotive, electrical equipment, wearables, and IoT devices.

Through its cutting-edge approach in leveraging topological material, TopoLogic, Inc. aims to revolutionize the design and performance of electronic devices, capitalizing on the unique physical mechanics offered by this advanced quantum material.

In their latest funding round in February 29, 2024, TopoLogic Inc. secured a remarkable investment of ¥700.00M, led by a consortium of prominent investors including Daiwa Corporate Investment, IT-Farm, UTokyo Innovation Platform, SBI Investment, Plug and Play Japan, Japan Material Technologies, and the Japan Science and Technology Agency.

This substantial investment signifies the strong confidence that industry leaders and key stakeholders have in TopoLogic's pioneering work and its potential to make significant strides in the manufacturing industry with its groundbreaking applications of topological material.