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Boschman Advanced Packaging Technology logo — We love to package your chips!

Boschman Advanced Packaging Technology

We love to package your chips!

Founded 1987 The Netherlands The Netherlands 86 employees Private Equity Semiconductor

General Information

Company Name Boschman Advanced Packaging Technology
Founded Year 1987
Location The Netherlands The Netherlands +1
Employees 86
Industries Semiconductor
Funding Stage Private Equity
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About Boschman Advanced Packaging Technology

Boschman Advanced Packaging Technology is a semiconductor assembly solution company, headquartered in The Netherlands and founded in 1987. The company specializes in providing quality solutions for specific market segments such as Mems & Sensors, Smartcards, and Powers. They have expertise in molding and Ag-Sinter systems and boast a modern, well-equipped facility in The Netherlands. The company's systems R&D facility in The Netherlands houses experts in mechanical, electrical, software, process, and mold/tool design, working collaboratively to achieve the best total system solution. The production site in Singapore, established in 1997, has gradually developed local capabilities for manufacturing the molding and sinter systems. Notably, the last investment in the company was a Private Equity Round in 14 March 2017 led by Holland Capital. Overall, Boschman Advanced Packaging Technology is positioned as a dynamic high-tech company with a solid track record serving the semiconductor assembly industry, and its partnership with Holland Capital demonstrates the confidence of prominent investors in the company's potential.

Taxonomy: Semiconductor industry, Advanced packaging technology, Molding systems, Ag-Sinter systems, MEMS & Sensors, Smartcards, Powers, High-tech, R&D, Netherlands-based company, Singapore production facility, Quality solutions, Global semiconductor industry, Material testing, Sustainability focus

Funding Rounds & Investors (1)

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Funding Stage Amount Investors Lead Investors Date
Private Equity Round •••••• 1
Investor
14 Mar 2017

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FAQ About Boschman Advanced Packaging Technology

We love to package your chips!
Boschman Advanced Packaging Technology was founded in 1987.
Boschman Advanced Packaging Technology is headquartered in The Netherlands.
Boschman Advanced Packaging Technology operates in the following industries: Semiconductor.
Boschman Advanced Packaging Technology has approximately 86 employees.
Boschman Advanced Packaging Technology has completed 1 funding round. The latest funding stage is Private Equity.
Top alternatives and competitors to Boschman Advanced Packaging Technology include Therm-X, California, SunRay Scientific Inc., Zettaone Technologies, bb7 product development. These companies operate in related industries and serve comparable markets. You can compare them side by side on Bounce Watch.
Boschman Advanced Packaging Technology and Therm-X, California are both companies in similar industries. Compare their funding, team size, growth signals, and market position on Bounce Watch to see which one fits your needs.

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