Tessolve

Tessolve's Turnkey ASIC Solution spans from design to packaged parts, leveraging its strengths in front-end design integrated with back-end flow knowledge to reduce design flaws and mitigate re-design costs and risks. The company is actively involved in R&D initiatives such as 5G, mmWave, silicon photonics, HSIO, HBM/HPI, and system-level test. Under an ODM model, Tessolve offers end-to-end product design services in the embedded domain, catering to segments like Avionics, Automotive, Industrial, and Medical with expertise in application.

Notably, Tessolve's clientele includes Tier 1 clients across multiple market segments, 7 of the top 10 semiconductor companies, start-ups, and government entities. With a strong global presence, Tessolve has office locations in the United States, India, Singapore, Malaysia, Germany, United Kingdom, China, UK, Japan, Thailand, Philippines, and test labs in India, Singapore, Malaysia, Austin, and San Jose.

In its most recent funding round on 22 April 2021, the company secured a $40 million Private Equity Round investment from Novo Tellus. This investment reflects the confidence in Tessolve's innovative solutions and its position as a key player in the semiconductor engineering and turnkey solutions space.