Tsingmicro

Tsingmicro is a leading company in Coarse-grained Reconfigurable Architecture (CGRA) of chip, offering chip products and solutions spanning from the edge side to the cloud side. The team, hailing from the Microelectronics Institute of Tsinghua University, possesses 13 years of experience in chip architecture design, research, and development, along with expertise in chip design, software, algorithms, and systems development. Notably, they have received several accolades, including the National Technology Invention Award and the China Patent Gold Award.

CGRA, a novel chip architecture, allows flexible reconstruction of hardware resources according to distinct applications or algorithms. As an original technology with complete intellectual property rights in China, it is hailed as the most promising future computing architecture by the International Semiconductor Technology Roadmap. Tsingmicro's voice AI SoC TX210, commercially launched in June 2019, stands as the premier application of CGRA chips. The release of TX510 in September expanded their capabilities to support multi-modal intelligent processing, positioning it as the world's first Multi-modality intelligent computing chip.

Established in 2018 and based in China, Tsingmicro recently secured a CNY100.00M Series B investment on 24 March 2022. The investment was led by prominent venture capital firms including Legend Capital, ProCapital, Z&Y Capital, Zhuoyuan Capital, and SenseTime.