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Wiseetec

Innovative solutions for semiconductor bonding and debonding needs

Founded 2021 Series B Total: $200.00M Semiconductor

General Information

Company Name Wiseetec

Founded Year 2021

Industries Semiconductor

Funding Stage Series B

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About Wiseetec

Wiseetec is a cutting-edge startup that specializes in providing innovative solutions for semiconductor bonding and debonding needs. The company, founded in 2021, focuses on research, development, manufacturing, and sales of semiconductor equipment, with a strong expertise in bonding and debonding solutions tailored to the semiconductor industry. With a wide range of applications, Wiseetec offers comprehensive solutions for both temporary and permanent bonding requirements. Their recent achievement includes securing a significant CNY100.00M Series B investment on 18 December 2023. This investment was made possible through the participation of prominent investors such as Sky9 Capital, Sunic Capital, Beijing Huafang Investment, 深圳市高新投集团有限公司, Zhuoyuan Capital, and Fortune Fountain Capital. As a result, Wiseetec is poised to accelerate their growth and development in the semiconductor industry.

Taxonomy: semiconductor equipment, bonding equipment, debonding equipment, sales, temporary bonding, permanent bonding, semiconductor industry, innovation

Funding Rounds & Investors (2)

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Funding Stage	Amount	Investors	Lead Investors	Date
Series B	••••••	6	•••• ••••	18 Dec 2023
Series A	••••••	4	•••• ••••	08 Oct 2022

Wiseetec Alternatives & Competitors

Wiseetec vs

OSIRIS International GmbH Germany

Your partner for photolithography process equipment.

20 employees

Industrial, Manufacturing

Wiseetec vs

Finetech Germany

We provide equipment solutions for the semiconductor industry - from R&D to automated production.

226 employees

Design, Manufacturing

Wiseetec vs

Trion Technology, Inc. United States

Original equipment manufacturer of custom plasma etch, strip, and deposition equipment for the semic...

16 employees

Manufacturing

FAQ About Wiseetec

Innovative solutions for semiconductor bonding and debonding needs

Wiseetec was founded in 2021.

Wiseetec operates in the following industries: Semiconductor.

Wiseetec has completed 2 funding rounds, raising a total of $200.00M. The latest funding stage is Series B.

Top alternatives and competitors to Wiseetec include OSIRIS International GmbH, Finetech, Trion Technology, Inc., CONNECTEC JAPAN Corporation, EV Group. These companies operate in related industries and serve comparable markets. You can compare them side by side on Bounce Watch.

Wiseetec and OSIRIS International GmbH are both companies in similar industries. Compare their funding, team size, growth signals, and market position on Bounce Watch to see which one fits your needs.

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