常州承芯半导体有限公司
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About 常州承芯半导体有限公司
No detailed description available yet for 常州承芯半导体有限公司.
Track 常州承芯半导体有限公司 for updatesFunding Rounds & Investors (2)
View All| Funding Stage | Amount | Investors | Lead Investors | Date |
|---|---|---|---|---|
| Series A | CNY1.00B | 8 |
|
21 Jan 2022 |
| Angel Round | Undisclosed | 2 |
Qitai Capital, KQ Capital
|
01 Sep 2021 |
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Source: BounceWatch company record for 常州承芯半导体有限公司, https://bouncewatch.com/company/-199, updated 11 September 2024. When citing, please name BounceWatch and link this page.
