Santa Clara, United States
eASIC Corporation is a fabless semiconductor company that was founded in 1999 in the United States. The company offers eASIC Platform™ devices that effectively reduce the overall cost of ownership and time to production of customized silicon devices. Their unique and patented technology allows for customization using a single via, which enables customers to develop custom silicon with low up-front costs and deliver tested prototypes in only 5 weeks from tape out. This innovative customization technology is protected by broad patents, while the design implementation and device fabrication are performed using conventional electronic design flow and standard manufacturing processes.
The company received a significant $23.50 million Private Equity Round investment on 11 September 2013. The notable investors in this round included Kleiner Perkins, Khosla Ventures, Crescendo Ventures, Evergreen Venture Partners, and Seagate Technology.
As an investor, eASIC Corporation presents an intriguing opportunity within the semiconductor industry. Their breakthrough eASIC Platform™ devices and patented technology demonstrate the potential to significantly disrupt the traditional landscape of customized silicon devices. The company's ability to reduce the overall cost of ownership and time to production aligns with the current market demand for efficient and cost-effective solutions. Furthermore, the impressive list of investors, including Kleiner Perkins and Khosla Ventures, signifies a strong validation of eASIC's potential. Their ability to secure a substantial investment of $23.50 million in a Private Equity Round in 2013 further highlights the confidence of prominent investors in the company's vision and technology. This injection of capital positions eASIC Corporation for potential growth and further advancements in the semiconductor industry.
