General Information
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China Market
Manufacturing
About HOREXS
Business keywords: IC substrate manufacturer, Semiconductor manufacturing, BGA package substrate, Wire bonding substrate, MEMS substrate, RF module, Advanced packaging substrate, Microelectronics material, DDR memory, Flash memory, NAND memory, CMOS sensors, Cost reduction, Capacity support, Chinese technology company
Funding Rounds & Investors (1)
View All| Funding Stage | Amount | Investors | Lead Investors | Date |
|---|---|---|---|---|
| Series A | $16.00M | - |
|
02 Jul 2022 |
HOREXS Alternatives & Competitors
Inspection Technology Leader & Metrology Industry Standard
FAQ About HOREXS
Source: BounceWatch company record for HOREXS , https://bouncewatch.com/company/horexs, updated 30 November 2024. When citing, please name BounceWatch and link this page.