General Information
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China Market
Manufacturing
About HOREXS
Taxonomy: IC substrate manufacturer, Semiconductor manufacturing, BGA package substrate, Wire bonding substrate, MEMS substrate, RF module, Advanced packaging substrate, Microelectronics material, DDR memory, Flash memory, NAND memory, CMOS sensors, Cost reduction, Capacity support, Chinese technology company
Funding Rounds & Investors (1)
View All| Funding Stage | Amount | Investors | Lead Investors | Date |
|---|---|---|---|---|
| Series A | •••••• | - | 02 Jul 2022 |
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