广东芯聚能半导体有限公司 logo — Pioneering the future of new energy vehicles and power semic...

广东芯聚能半导体有限公司

Pioneering the future of new energy vehicles and power semiconductors with exceptional packaging and modules.

Founded 2018 3 employees Series C Energy, Manufacturing +1

General Information

Company Name 广东芯聚能半导体有限公司
Founded Year 2018
Employees 3
Industries Energy, Manufacturing, Automotive
Funding Stage Series C
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About 广东芯聚能半导体有限公司

Guangdong Xinjuneng is a pioneering company focused on the future of new energy vehicles and power semiconductors. Founded in 2018, the company specializes in semiconductor devices and is involved in design, research, development, and production. Their primary focus is on the new energy vehicle and power semiconductor application market, offering power semiconductor packaging, modules, and various other products. The company recently received a Series C investment on 27 December 2022. The investment was led by a group of prominent investors including Eastern Bell Capital, Geely, CCB Trust, Guangdong Yuecai Venture Capital Co., Ltd., China Fellow Partners, Boyuan Capital, Midea Group, and Guangzhou Yuexiu Industrial Investment Fund.

Taxonomy: Semiconductor Devices, Power Semiconductors, Packaging, Modules, New Energy Vehicles, Research and Development, Integrated Circuits, Electric Vehicles, Energy Technology, Semiconductor Industry, Semiconductor Manufacturing, Innovation, Technology

Funding Rounds & Investors (2)

View All
Funding Stage Amount Investors Lead Investors Date
Series C •••••• 8
Investor Investor Investor Investor Investor Investor
•••• ••••
27 Dec 2022
Venture Round •••••• 1
Investor
18 Nov 2021

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FAQ About 广东芯聚能半导体有限公司

Pioneering the future of new energy vehicles and power semiconductors with exceptional packaging and modules.
广东芯聚能半导体有限公司 was founded in 2018.
广东芯聚能半导体有限公司 operates in the following industries: Energy, Manufacturing, Automotive.
广东芯聚能半导体有限公司 has approximately 3 employees.
广东芯聚能半导体有限公司 has completed 2 funding rounds. The latest funding stage is Series C.
Top alternatives and competitors to 广东芯聚能半导体有限公司 include Hestia Power, Xinta Electronics, Cambridge GaN Devices Ltd, Empower Micro Systems Inc., Wolfspeed. These companies operate in related industries and serve comparable markets. You can compare them side by side on Bounce Watch.
广东芯聚能半导体有限公司 and Hestia Power are both companies in similar industries. Compare their funding, team size, growth signals, and market position on Bounce Watch to see which one fits your needs.

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