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PiBond logo — Lithography and patterning, low-k and optical dielectrics an...

PiBond

Lithography and patterning, low-k and optical dielectrics and material packaging for semiconductors and photonics.

Founded 2014 Finland Finland 48 employees Private Equity Consumer Electronics, Manufacturing

General Information

Company Name PiBond
Founded Year 2014
Location Finland Finland
Employees 48
Industries Consumer Electronics, Manufacturing
Funding Stage Private Equity
Social

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About PiBond

PiBond is a Finland-based startup specializing in lithography and patterning, low-k and optical dielectrics, and material packaging for semiconductors and photonics. Established in 2014, the company has positioned itself as one of the leading providers of ultra-high purity siloxane and metal organic polymer materials for the semiconductor industry. Their products are integral to various applications including integrated circuits, CMOS image sensors, and photolithographic processes.

Having been in the industry for close to a decade, PiBond has been supplying advanced materials for the latest technology nodes. This commitment to innovation and production of enabling products places them at the forefront of the industry's evolution. Whether it's the pursuit of even smaller semiconductor nodes, the advent of 3D-IC packaging, glass and silicon interposers, complex MEMS, or novel display devices, PiBond is dedicated to driving change and progress in the industry.

The company's last private equity round investment took place on 01 January 2015 and was led by AGIC Capital. With a focus on the consumer electronics and manufacturing industries, PiBond is positioned for continued growth and influence in the semiconductor sector.

Business keywords: Semiconductor Materials, Advanced Technology Nodes, MEMS, IC Packaging, Siloxane Materials, Metal Organic Polymers, Lithography, Patterning, Photonics, Optical Dielectrics, Integrated Circuits, CMOS Image Sensors, Foundries, Device Design, Wafer Level Packaging

Funding Rounds & Investors (1)

View All
Funding Stage Amount Investors Lead Investors Date
Private Equity Round Undisclosed 1
AGIC Capital
AGIC Capital
01 Jan 2015

PiBond Alternatives & Competitors

PiBond vs
Promerus, LLC
Promerus, LLC United States

Promerus develops advanced material solutions based on polynorbornenes for the next generation of ap...

35 employees
Consumer Electronics, IT

FAQ About PiBond

Lithography and patterning, low-k and optical dielectrics and material packaging for semiconductors and photonics.
PiBond was founded in 2014.
PiBond is headquartered in Finland.
PiBond operates in Consumer Electronics and Manufacturing. Its work centres on Semiconductor Materials, Advanced Technology Nodes, MEMS and IC Packaging.
PiBond has approximately 48 employees.
PiBond has completed 1 funding round. The latest funding stage is Private Equity.
Top alternatives and competitors to PiBond include Promerus, LLC. These companies operate in related industries and serve comparable markets. You can compare them side by side on Bounce Watch.
PiBond and Promerus, LLC are both companies in similar industries. Compare their funding, team size, growth signals, and market position on Bounce Watch to see which one fits your needs.

Source: BounceWatch company record for PiBond, https://bouncewatch.com/company/pibond, updated 5 January 2025. When citing, please name BounceWatch and link this page.

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