General Information
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About Xinde Semiconductor
Taxonomy: semiconductor packaging, testing solutions, mobile technology, turnkey services, high-tech packaging, mid-end packaging, back-end packaging, mobile products
Funding Rounds & Investors (4)
View All| Funding Stage | Amount | Investors | Lead Investors | Date |
|---|---|---|---|---|
| Venture Round | CNY600.00M | 4 | 25 Oct 2023 | |
| Series A | Undisclosed | 4 | 20 Oct 2021 | |
| Series A | Undisclosed | 2 | 01 Aug 2021 | |
| Angel Round | Undisclosed | - |
|
01 Jan 2021 |
Xinde Semiconductor Alternatives & Competitors
Offering comprehensive semiconductor packaging and testing solutions on a global scale
FAQ About Xinde Semiconductor
Source: BounceWatch company record for Xinde Semiconductor, https://bouncewatch.com/company/xinde-semiconductor, updated 12 September 2024. When citing, please name BounceWatch and link this page.